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Apple looks towards structural bonding for thinner, lighter notebooks
Posted by Bob on: 2007-05-17 17:24:02 [ Print | Permalink ]

In keeping up with the trend towards thinner and lighter notebook models, Apple in a recent filing discloses methods for improving enclosure designs through parts that are structurally and electrically bonded together during the manufacturing process...

>> Apple looks towards structural bonding for thinner, lighter notebooks


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News Source: Apple Insider

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