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Apple looks towards structural bonding for thinner, lighter notebooks

Posted by Bob on: 05/17/2007 04:24 PM [ Print | 0 comment(s) ]

In keeping up with the trend towards thinner and lighter notebook models, Apple in a recent filing discloses methods for improving enclosure designs through parts that are structurally and electrically bonded together during the manufacturing process...

Apple looks towards structural bonding for thinner, lighter notebooks